New material conducts heat better than copper
Electron microscope image (left) and X-ray diffraction image (right) of a single crystal of theta-phase tantalum nitride (Image: courtesy of Yongjie Hu/UCLA.)
April 9, 2026 – Researchers at Argonne National Laboratory have developed a material that conducts heat nearly three times better than copper. The material, a form of tantalum nitride, could improve cooling in electronics such as computers and data centers. Although still in the research stage, it offers potential for applications where efficient heat management is essential.
